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 National Science
Foundation Award #9015475 |
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Corrosion Processes in Thin Films
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| Investigator(s): |
Joe Payer (PI)
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| Sponsor: |
Case Western Reserve University, OH 44106 2163684510
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| Start Date/Expiration Date |
1991-08-01 to 1995-07-31 (amended 1993-05-07) |
| Awarded Amount to Date: |
$286,700 |
| Abstract: This program looks at corrosion mechanisms in thin films of electronic materials with emphasis on atmospheric corrosion in copper. In air copper develops a thin surface film of oxide. Subsequent exposure to moist environments containing corrosive gases, such as sulfur dioxide, aids the growth of corrosion products on the surface. Of special interest are the microcell corrosion processes pertaining to the conversion of an approximately 20 Angstrom film of cuprite to a 200 Angstrom film of cuprite and copper sulfide. The studies include corrosion of polycrystalline copper, single crystal copper, and vacuum-deposited copper foils. The thin film growth process, chemistry, structure, and morphology are determined by several surface analytical techniques, including Auger spectroscopy, transmission electron microscopy, and associated diffraction methods. %%% There is a need for improved understanding of atmospheric corrosion of microelectronic devices to improve their resistance to degradation. This research on copper provides a foundation for the investigation of other metals, alloys and semiconductors of commercial importance in thin film technologies. |
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| NSF Org: |
DMR - Division of Materials Research |
| Award Number: |
9015475 |
| Award Instrument: |
Continuing grant |
| Program Manager: |
K. Linga (KL) Murty
DMR Division of Materials Research
MPS Directorate for Mathematical & Physical Sciences
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| NSF Program(s): |
METALS, METALS
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| Field Application(s): |
Engineering-Metallurgy & Material, Materials Research, Metals, Ceramics & Electronic Materials |
| Program Reference Code(s): |
SINGLE DIVISION/UNIVERSITY, 9161 |
| Program Element Code(s): |
1771
, 1771
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